design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. esd suppressor e 1 z 2 a 3 e 4 g 5 2 6 a 7 5 8 0 9 a 10 x 11 product code esd suppressor size code 1 2 3 size (inches) 0603 (0201) 1005 (0402) 1608 (0603) packaging methods code c ezaeg1a packaging type pressed carrier taping 2m mp itch, 15000 pcs. x ezaeg2a pressed carrier taping 2m mp itch, 10000 pcs. v EZAEG3A punched carrier taping 4mmpitch,5000pcs. design specification code a design specification rated voltage 30 v special feature code a special feature standard peak voltage code 50 peak voltage 500 v a b t w l protective coating alumina substrate gap electrode electrode (between) esd absorbent material electrode (outer) esd suppressor type: ezaeg ezaeg1a, 2a, 3a features esd protection of high-speed data lines low capacitance (1608 size : 0.1 pf, 1005 size : 0.05 pf, 0603 size : 0.04 pf) good esd suppression characteristics good es d withstanding explanation of part numbers dimensions in mm (not to scale) construction recommended applications high-speed data lines (hdmi, serial ata, usb, ieee1394, display port) antenna circuitry and rf modules (cellular phones) circuit con? guration type (inches) dimensio ns (mm) mass (w eight) [g/1 000 pcs.] lwa b t ezaeg1a (0201) 0.60 0.03 0.30 0.03 0.15 0.10 0.15 0.10 0.23 0.03 0.12 ezaeg2a ( 0402) 1.00 0.10 0.50 0.05 0.20 0.10 0.25 0.10 0.38 0.05 0.6 EZAEG3A (0603) 1.60 0.15 0.80 0.15 0.30 0.20 0.30 0.20 0.50 0.10 2.2 feb. 2009
esd suppressor design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. -30 -25 -20 -15 -10 -5 0 5 11 0 100 1000 10000 frequency(mhz) attenuation (db) -50 0 50 100 150 200 250 300 350 400 -20 0 20 40 60 80 100 120 140 160 180 200 times (nsecs) volts (v) hdmi controller hdmi rx/tx antenna ga/as-sw or asm (1) capacitanc e = the capacitance value shall be measured under the conditions speci ed below. frequency : 1 mhz 10 %, voltage : 1 vrms 0.2 vrms, temperature : 25 c 2 c (2) peak voltage = the peak voltage value shall be measured under the following conditions. esd test conditions : iec61000-4-2, 8 kv contact discharge (3) clamping voltage = the clamping voltage value shall be measured at 30 ns after initiation of pulse and measured under the c onditions speci? ed below. esd test conditions : iec61000-4-2, 8 kv contact discharge ratings frequency characteristics esd suppression voltage waveform typical circuits requiring protection hdmi circuit antenna circuit packaging methods (taping) standard quantity type kind of taping pitch (p 1 )quantity ezaeg1a pressed carrier taping 2 mm 15 000 pcs./reel ezaeg2a 1 0000 pcs./reel EZAEG3A punched carrie r taping 4 mm 5000 pcs./reel type (inches) capacitance (1) peak voltage (2) clamping voltage (3) rated vo ltage category temperature range (operating temperature range) ezaeg1a (0 20 1) 0.04 +0.04 pf 500 v max. (350 v typ.) 100 v max. 30 v max ?55 to +125 c ezaeg2a ( 040 2) 0.05 +0.05 pf EZAEG3A (0 60 3) 0.10 +0.10 pf ?0.04 ?0.03 ?0.08 feb. 2009
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. esd suppressor esd suppressor c a b c a b w t tt a p 0 p 2 p 1 p 1 d 0 b f w e ( 2m m pitch ) type (inches) dimensions (mm) abc ezaeg1a (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 ezaeg2a (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 EZAEG3A (0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 in case of ? ow soldering, the land width must be small er than the esd suppressor width to properly control the sol der amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of esd suppressor. in case of re? ow soldering, solder amount can be adjusted, there fore the land width should be set to 1.0 to 1.3 times esd suppressor width (w). recommended land pattern taping reel carrier taping type a b c wt ezaeg1a 180.0 +0 60 min. 13.0 1.0 9.0 1.0 11.4 1.0 ezaeg2a EZAEG3A ?3.0 (unit : mm) t ype a b w f e p 1 p 2 p 0 d 0 t ezaeg1a 0.38 0.05 0.68 0.05 8.00 0.20 3.50 0.05 1.75 0.10 2.00 0.10 2.00 0.05 4.00 0.10 1.50 +0.10 0.42 0.05 ezaeg2a 0.70 0.05 1.20 0.05 0.60 0.05 EZAEG3A 1.10 0.10 1.90 0.10 4.00 0.10 0.70 0.05 pressed carrier punched carrier ?0 (unit : mm) feb. 2009
esd suppressor design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 c max. 10 s recommended soldering conditions recommendations and precautions are described below. recommended so ldering conditions for re? ow for soldering (example : sn/pb) for lead-free soldering (example : sn/ag/cu) safety precautions t he following are precautions for individual products. please also refer to the precautions common to emi filters, esd suppressors, fuses, and mr sensors shown on page el113 of this catalog. 1. if a larg e electric surge (especially, one which is larger than an esd) is expected to be applied, be sure to test and con? rm proper esd suppressor (hereafter called the suppress ors) functional ity when mounted on your board. when the applied load is more than the allowable rated power unde r normal load conditions, it may impair performance and/or the reliability of the suppressors. never exceed the rated power. if the product will be used under these special conditions, be sure to contact a panasonic representative ? rst. 2. do not us e halogen-based or other high-activity ? ux. otherwise, th e residue may impair the suppressors' performance and/or re liability. 3. when soldering wi th a soldering iron, never touch the suppressors' bodie s with the tip of the soldering iron. when using a soldering iron with a high temperature tip, ? nish soldering as quickly as possible (within three seconds at 350 c max.). 4. avoid excessive bending of printed circuit boards in order to protect the suppressors from abnormal stress. 5. do no t immerse the suppressors in solvent for a long time. be fore u sing solvent, carefully check the effects of im mer sion. re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. feb. 2009
? er3 ? safety precautions (common precautions for esd suppressors) when using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this cata log explains the quality and performance of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause th e loss of human life or other signi? cant damage, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerosp ace equipment, electric heating appliances, combustion/gas equipment, rotating eq uipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equip ped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precauti ons for use these products are designed and manufactured for general and stan dard use in general electronic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication equipment) these products are no t intended for use in the following special co nditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electromagnetic environment avoid an y environment where strong electromagnetic waves exist. 5. in an environment where these products cause dew condensation 6. sealing or co ating of these products or a printed circuit board on which thes e products are mounted, with resin or othe r materials these products generate joule heat when energized. carefu lly position th ese products so that their he at will not affect th e other components. carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating components. do not moun t or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products . note that non- cleaning solder, halogen-based highly active ? ux, or wate r-soluble ? ux may dete riorate the performance or reliab ility of the products. carefully select a ? ux cleaning agent fo r use after soldering. an unsuit able agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. otherwise, the insulation performance may be deteriorated. (2) precaution s for storage the performanc e of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 c to 35 c and a relative humidity of 45 % to 85 %. even wi thin the above guarantee periods, do not store these pr oducts in the following conditions. otherwise, their electrical performance and/or solderability may be deteri orated, an d the packaging materials (e.g. taping materials) may be de formed or dete riorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package ma rkings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. dec. 2007
mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: panasonic: ? eza-eg1a50ac
|
